113 lines
4.2 KiB
Markdown
113 lines
4.2 KiB
Markdown
# Ordering & Assembly Guide
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## JLCPCB Order Settings
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Upload `baby-mobile-panel.kicad_pcb` gerbers with these options:
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| Setting | Value |
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|---|---|
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| Layers | 2 |
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| PCB Thickness | 1.6mm (carrier) / 0.8mm works too |
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| Surface Finish | LeadFree HASL (cheapest) or ENIG |
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| **Castellated Holes** | **Yes** (required for adapters) |
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| **V-Score** | **Yes** (break between carrier and adapters) |
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| Quantity | 5 (minimum) |
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| **Estimated Cost** | **~$8 for 5 panels** |
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If ordering JLC assembly (SMT), upload `carrier_bom_jlc.csv`.
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Otherwise, hand-solder the carrier components yourself — everything
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is 0805 or larger except the TPS61220 (SC-70-5, fine-pitch but doable
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with flux and a fine tip).
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## Carrier Board BOM
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| Ref | Part | Package | LCSC | ~Cost | Notes |
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|---|---|---|---|---|---|
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| U1 | TPS61220DCKR | SC-70-5 | C83951 | $0.80 | **Pin 1 dot on silk** |
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| U2 | IS25LP128F-JBLE | SOIC-8 | C194872 | $1.80 | **Pin 1 dot on silk** |
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| L1 | 4.7µH inductor | 0805 | C408336 | $0.15 | |
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| C1 | 10µF ceramic | 0805 | C15850 | $0.05 | Boost input |
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| C2 | 10µF ceramic | 0805 | C15850 | $0.05 | Boost output |
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| C3 | 100nF ceramic | 0805 | C49678 | $0.01 | Flash decoupling |
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| C4 | 100nF ceramic | 0805 | C49678 | $0.01 | (optional XIAO decoupling) |
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| C5 | 10nF ceramic | 0805 | C1710 | $0.01 | Audio LPF |
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| R1 | 4.7KΩ | 0805 | C17673 | $0.01 | Audio LPF |
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| R2 | 10KΩ | 0805 | C17414 | $0.01 | Flash CS pullup |
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| J1 | JST SH 10-pin SMD | 1.0mm | C160404 | $0.30 | Right-angle |
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| J2,J3 | Female header 1×7 | 2.54mm | C124378 | $0.20 | XIAO socket (×2) |
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| — | Seeed XIAO nRF52840 | module | — | $9.90 | From Seeed/Amazon |
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| | **Carrier subtotal** | | | **~$13.30** | |
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### Not on PCB (buy separately)
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| Item | Source | ~Cost |
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|---|---|---|
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| JST SH 10-pin cable (both ends female) | Amazon/AliExpress | $1.50 |
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| 30AWG wire (for adapter-to-JST) | Amazon | $5/spool |
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| 2×AA battery holder | Reuse from toy | $0 |
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## Breakaway Adapter BOM
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The adapters are **passive PCBs** — no components except one JST SH
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connector each. Buy the connector that matches your adapter:
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| Adapter | JST SH Pins | LCSC | ~Cost |
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|---|---|---|---|
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| SOP-8 | 8-pin | C160402 | $0.25 |
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| SOP-16 narrow | 10-pin | C160404 | $0.30 |
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| SOP-16 wide | 10-pin | C160404 | $0.30 |
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You only need one adapter per toy — snap off the right one.
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## Assembly Order
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### 1. Carrier board (do this first, test before connecting to toy)
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1. **Solder U1 (TPS61220)** — align pin 1 dot. Tin one pad, place
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chip, reflow that pad, then solder remaining 4 pins.
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2. **Solder L1, C1, C2** — boost converter circuit. Apply 2×AA
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battery voltage to VBAT/GND test points. Measure 3V3 output —
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should read 3.30V ±0.1V.
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3. **Solder U2 (IS25LP128F)** — align pin 1 dot. Same technique as U1.
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4. **Solder C3, R2** — flash decoupling and CS pullup.
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5. **Solder R1, C5** — audio RC filter.
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6. **Solder J1 (JST SH)** — align pin 1 mark.
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7. **Solder J2, J3** — XIAO female headers.
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8. **Plug in XIAO** — USB-C faces the left edge marked on silk.
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9. **Test** — upload pin_discovery.ino, verify serial output.
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### 2. Adapter board
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1. **Snap off** the adapter matching your toy's MCU package.
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2. **Solder JST connector** to adapter's top surface.
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3. **Desolder** original MCU from toy PCB (hot air or iron + flux).
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4. **Place adapter** in empty footprint, pin 1 aligned.
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5. **Solder castellated edges** — the half-holes sit on the SOP pads.
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Apply flux, touch with iron, solder wicks into the half-hole.
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6. **Plug JST cable** from adapter into carrier J1.
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### 3. Map and wire
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1. Upload **pin_discovery.ino** to XIAO.
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2. Use multimeter + the serial tool to identify each SOP pin's function.
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3. Create your pin map (see BRAIN_TRANSPLANT.md).
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4. Update **baby_mobile_v2.ino** pin definitions.
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5. Upload final firmware.
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6. Upload audio via USB mass storage.
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## Silkscreen Guide
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All polarized components have pin 1 dots (●) on the silkscreen:
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- **U1 (TPS61220):** dot near pin 1 (VIN)
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- **U2 (IS25LP128F):** dot near pin 1 (~CS)
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- **J1 (JST SH):** dot near pin 1 (VBAT)
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- **Each adapter:** dot near SOP pin 1
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The XIAO outline shows the board rectangle with a USB-C bump
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on the left edge. Pin labels (D0-D10, 3V3, GND, 5V) are printed
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next to each header hole.
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